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Small Outline, 5 Lead, High Speed Optocouplers Technical Data
HCPL-M452 HCPL-M453
Features
* Surface Mountable * Very Small, Low Profile JEDEC Registered Package Outline * Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes * Very High Common Mode Transient Immunity: 15000 V/s at VCM = 1500 V Guaranteed (HCPL-M453) * High Speed: 1 Mb/s * TTL Compatible * Guaranteed AC and DC Performance over Temperature: 0C to 70C * Open Collector Output * Recognized Under the Component Program of U.L. (File No. E55361) for Dielectric Withstand Proof Test Voltage of 3750 Vac, 1 Minute * Lead Free Option
Description
These small outline high CMR, high speed, diode-transistor optocouplers are single channel devices in a five lead miniature footprint. They are electrically equivalent to the following Agilent optocouplers: SO-5 Package HCPL-M452 HCPL-M453 Standard DIP HCPL-4502 HCPL-4503 SO-8 Package HCPL-0452 HCPL-0453
(Note: These devices equivalent to 6N135/6N136 devices but without the base lead.)
The SO-5 JEDEC registered (MO-155) package outline does not require "through holes" in a PCB. This package occupies approximately one-fourth the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes.
These diode-transistor optocouplers use an insulating layer between the light emitting diode and an integrated photon detector to provide electrical insulation between input and output. Separate connections for the photodiode bias and output transistor collector increase the speed up to a hundred times
CAUTION: The small device geometries inherent to the design of this bipolar component increase the component's susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
2
over that of a conventional photo-transistor coupler by reducing the base-collector capacitance. The HCPL-M452 is designed for high speed TTL/TTL applica-
tions. A standard 16 mA TTL sink current through the input LED will provide enough output current for 1 TTL load and a 5.6 k pull-up resistor. CTR of the HCPL-M452 is 19% minimum at IF = 16 mA.
The HCPL-M453 is an HCPLM452 with increased common mode transient immunity of 15,000 V/s minimum at VCM = 1500 V guaranteed.
Outline Drawing (JEDEC MO-155)
Schematic
ICC 6 VCC
ANODE 1 4.4 0.1 (0.173 0.004)
6
VCC
+ ANODE 1 VF
IF
MXXX XXX
7.0 0.2 (0.276 0.008) CATHODE 3
5 VOUT 4 GND
CATHODE
- 3 SHIELD
IO
5
VO
4 GND
0.4 0.05 (0.016 0.002) 3.6 0.1* (0.142 0.004) 0.102 0.102 (0.004 0.004) 0.15 0.025 (0.006 0.001) 7 MAX. 1.27 BSC (0.050) 0.71 MIN. (0.028) MAX. LEAD COPLANARITY = 0.102 (0.004) DIMENSIONS IN MILLIMETERS (INCHES) * MAXIMUM MOLD FLASH ON EACH SIDE IS 0.15 mm (0.006) NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
2.5 0.1 (0.098 0.004)
Applications
* Line Receivers High common mode transient immunity (>1000 V/s) and low input-output capacitance (0.6 pF). * High Speed Logic Ground Isolation - TTL/TTL, TTL/ LTTL, TTL/CMOS, TTL/ LSTTL. * Replace Slow Phototransistor Optocouplers * Replace Pulse Transformers - Save board space and weight * Analog Signal Ground Isolation Integrated photon detector provides improved linearity over phototransistor type.
Land Pattern Recommendation
4.4 (0.17)
2.5 (0.10)
1.3 (0.05)
2.0 (0.080) 8.27 (0.325)
0.64 (0.025)
DIMENSIONS IN MILLIMETERS AND (INCHES)
3
Absolute Maximum Ratings
(No Derating Required up to 85C) Storage Temperature ................................................. -55C to +125C Operating Temperature ............................................. -55C to +100C Average Input Current - IF ..................................................... 25 mA[1] Peak Input Current - IF ........................................................... 50 mA[2] (50% duty cycle, 1 ms pulse width) Peak Transient Input Current - IF .............................................. 1.0 A (1 s pulse width, 300 pps) Reverse Input Voltage - VR (Pin3-1) ............................................... 5 V Input Power Dissipation ........................................................ 45 mW[3] Average Output Current - IO (Pin 5) ........................................... 8 mA Peak Output Current ................................................................. 16 mA Output Voltage - VO (Pin 5-4) ........................................ -0.5 V to 20 V Supply Voltage - VCC (Pin 6-4) ....................................... -0.5 V to 30 V Output Power Dissipation .................................................... 100 mW[4] Infrared and Vapor Phase Reflow Temperature .................. see below
Solder Reflow Thermal Profile
300
PREHEATING RATE 3C + 1C/-0.5C/SEC. REFLOW HEATING RATE 2.5C 0.5C/SEC. PEAK TEMP. 245C PEAK TEMP. 240C PEAK TEMP. 230C 2.5C 0.5C/SEC. 160C 150C 140C 3C + 1C/-0.5C 30 SEC. 30 SEC. SOLDERING TIME 200C
TEMPERATURE (C)
200
100
PREHEATING TIME 150C, 90 + 30 SEC. 50 SEC. TIGHT TYPICAL LOOSE
ROOM TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Recommended Pb-Free IR Profile
tp Tp TL 260 +0/-5 C 217 C RAMP-UP 3 C/SEC. MAX. 150 - 200 C RAMP-DOWN 6 C/SEC. MAX. TIME WITHIN 5 C of ACTUAL PEAK TEMPERATURE 20-40 SEC.
TEMPERATURE
Tsmax Tsmin
ts PREHEAT 60 to 180 SEC. 25 t 25 C to PEAK
tL
60 to 150 SEC.
TIME NOTES: THE TIME FROM 25 C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200 C, Tsmin = 150 C
4
Insulation Related Specifications
Parameter Min External Air Gap (Clearance) Min. External Tracking Path (Creepage) Min. Internal Plastic Gap (Clearance) Tracking Resistance Isolation Group (per DIN VDE 0109) Symbol L(IO1) L(IO2) Value 5 5 0.08 CTI 175 IIIa Units mm mm mm V Conditions Measured from input terminals to output terminals Measured from input terminals to output terminals Through insulation distance conductor to conductor DIN IEC 112/VDE 0303 Part 1 Material Group DIN VDE 0109
Electrical Specifications
Over recommended temperature (TA = 0C to 70C) unless otherwise specified. (See note 11.) Parameter Current Transfer Ratio Logic Low Output Voltage Logic High Output Current Logic Low Supply Current Logic High Supply Current Input Forward Voltage Input Reverse Breakdown Voltage Temperature Coefficient of Forward Voltage Input Capacitance Input-Output Insulation Resistance (Input-Output) Capacitance (Input-Output)
*All typicals at TA = 25C.
Symbol Min. Typ.* Max. Units CTR 20 15 VOL 24 25 0.1 0.4 0.5 IOH 0.003 0.01 0.5 1 50 ICCL 50 200 A V 50 %
Test Conditions TA = 25C VO = 0.4 V VO = 0.5 V TA = 25C IO = 3.0 mA IO = 2.4 mA TA = 25C VO = VCC = 5.5 V TA = 25C VO = VCC = 15.0 V IF = 0 mA IF = 16 mA, VO = Open, VCC = 15 V TA = 25C IF = 0 mA, VO = Open, VCC = 15.0 V
Fig. Note 5
VCC = 4.5 V 1, 2, IF = 16 mA 4
7
11
ICCH
0.02
1 2
11
VF
1.5
1.7 1.8
V
TA = 25C IF = 16 mA IR = 10 A
3
BVR
5
VF/TA
-1.6
mV/C IF = 16 mA
CIN VISO RI-O CI-O 3750
60
pF
f = 1 MHz, VF = 0 6, 7 6 6
VRMS RH 50%, t = 1 min., TA = 25C 1012 0.6 pF VI-O = 500 VDC f = 1 MHz
5
Switching Specifications
Over recommended temperature (TA = 0C to 70C) VCC = 5 V, IF = 16 mA unless otherwise specified. Parameter Propagation Delay Time to Logic Low at Output Propagation Delay Time to Logic High at Output Symbol tPHL Device Min. Typ.* Max. Units Test Conditions 0.2 0.8 1.0 s TA = 25C Fig. Note 9
5, 6, RL = 1.9 k 10
tPLH
0.6
0.8 1.0
TA = 25C
5, 6, RL = 1.9 k 10
9
Common |CMH| Mode Transient Immunity at Logic High Level Output Common |CML| Mode Transient Immunity at Logic Low Level Output Bandwidth BW
HCPLM452 HCPLM453 HCPLM452 HCPLM453 15 15
1
kV/s VCM = 10 Vp-p
11 IF = 0 mA TA = 25C RL = 1.9 k
8, 9
30
VCM = 1500 Vp-p
1
VCM = 10 Vp-p
IF = 16 mA 11 TA = 25C RL = 1.9 k
8, 9
30
VCM = 1500 Vp-p
3
MHz RL = 100 , See Test Circuit 8, 9
10
All typicals at TA = 25C.
Notes: 1. Derate linearly above 85C free-air temperature at a rate of 0.5 mA/C. 2. Derate linearly above 85C free-air temperature at a rate of 1.0 mA/C. 3. Derate linearly above 85C free-air temperature at a rate of 1.1 mW/C. 4. Derate linearly above 85C free-air temperature at a rate of 2.3 mW/C. 5. CURRENT TRANSFER RATIO in percent is defined as the ratio of output collector current, IO, to the forward LED input current, IF, times 100. 6. Device considered a two terminal device: pins 1 and 3 shorted together, and pins 4, 5 and 6 shorted together. 7. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage 4500 VRMS for 1 second (leakage detection current limit, II-O 5 A). 8. Common transient immunity in a Logic High level is the maximum tolerable (positive) dVCM/dt on the rising edge of the common mode pulse, VCM, to assure that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode transient immunity in a Logic Low level is the maximum tolerable (negative) dVCM/dt on the falling edge of the common mode pulse signal, VCM to assure that the output will remain in a Logic Low state (i.e., VO < 0.8 V). 9. The 1.9 k load represents 1 TTL unit load of 1.6 mA and the 5.6 k pull-up resistor. 10. The frequency at which the ac output voltage is 3 dB below its mid-frequency value. 11. Use of a 0.1 F bypass capacitor connected between pins 4 and 6 is recommended.
6
NORMALIZED CURRENT TRANSFER RATIO
IF - FORWARD CURRENT - mA
IO - OUTPUT CURRENT - mA
T = 25C 10 VA = 5.0 V CC
40 mA 35 mA 30 mA 25 mA
1.5
1000 TA = 25C 100 10 1.0 0.1 0.01 IF + VF -
1.0
5
20 mA 15 mA 10 mA IF = 5 mA
0.5
0 0 10 VO - OUTPUT VOLTAGE - V 20
0.1 0 1
NORMALIZED I F = 16 mA VO = 0.4 V VCC = 5 V TA = 25C 10 100
0.001 1.10
1.20
1.30
1.40
1.50
1.60
IF - INPUT CURRENT - mA
VF - FORWARD VOLTAGE - VOLTS
Figure 1. dc and Pulsed Transfer Characteristics.
Figure 2. Current Transfer Ratio vs. Input Current.
Figure 3. Input Current vs. Forward Voltage.
NORMALIZED CURRENT TRANSFER RATIO
1.1
tP - PROPAGATION DELAY - ns
2000
tP - PROPAGATION DELAY - s
3.0
IF = 16 mA, VCC = 5.0 V RL = 1.9 k
1.0
2.0
IF = 10 mA IF = 16 mA VCC = 5.0 V TA = 25 C
1500
0.9 NORMALIZED IF = 16 mA VO = 0.4 V VCC = 5 V TA = 25C
1000 tPLH 500 tPHL
1.0 0.8 0.6 0.4
tPLH
0.8
tPHL
0.7
0.2 0.1 1
0.6 -60
-20
20
60
100
140
0 -60
-20
20
60
100
2
3
4
5
6 7 8 9 10
TA - TEMPERATURE - C
TA - TEMPERATURE - C
RL - LOAD RESISTANCE - k
Figure 4. Current Transfer Ratio vs. Temperature.
Figure 5. Propagation Delay vs. Temperature.
Figure 6. Propagation Delay Time vs. Load Resistance.
10+4 10+3 10+2 10+1 10 0 10 -1 10 -2 -50 -25 0 +25 +50 +75 +100 IF = 0 VO = VCC = 5.0 V
IO IF - SMALL SIGNAL CURRENT TRANSFER RATIO
IOH - LOGIC HIGH OUTPUT CURRENT - nA
0.30
TA = 25C, RL = 100 , VCC = 5 V
0.20
0.10
0
0
4
8
12
16
25
TA - TEMPERATURE - C
IF - QUIESCENT INPUT CURRENT - mA
Figure 7. Logic High Output Current vs. Temperature.
Figure 8. Small-Signal Current Transfer Ratio vs. Quiescent Input Current.
7
0
NORMALIZED RESPONSE -dB
-5 -10 -15 -20 -25
TA = 25C IF = 16 mA RL = 100 RL = 220 RL = 470 RL = 1 k
-30 0.01
0.1
1.0
10
f - FREQUENCY - MHz
+5 V SET IF AC INPUT 0.1 F 500 100 20 k
2N3063
1
6 RL 5
+5 V
VO 3 4 0.1 F
1.5 V dc 0.25 Vp-p ac
Figure 9. Frequency Response.
IF 0 VO 1.5 V 1.5 V VOL tPHL tPLH 5V
PULSE GEN. ZO = 50 tr = 5 ns
IF +5 V 1 6 RL 5 0.1F VO
10% DUTY CYCLE 1/f 100 s
IF MONITOR 100
3
4 CL = 15 pF
Figure 10. Switching Test Circuit.
IF tr, tf = 16 ns VCM 0V tr 10 V 10% 90% 90% 10% tf VFF 5V SWITCH AT A: IF = 0 mA VO SWITCH AT B: IF = 1.6 mA VOL + 3 4 A 5 VO B 1 6
RCC (SEE NOTE 10) 220 RL VO 0.1F VCC
VCM -
PULSE GEN.
Figure 11. Test Circuit for Transient Immunity and Typical Waveforms.
www.agilent.com/semiconductors
For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright (c) 2004 Agilent Technologies, Inc. Obsoletes 5989-0792EN December 28, 2004 5989-2117EN

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